中圖分類號：TP368 文獻標(biāo)志碼：A DOI: 10.16157/j.issn.0258-7998.256913 中文引用格式： 李超，李賓，王艷. 多核異構(gòu)通用控制計算機模塊設(shè)計與實現(xiàn)[J]. 電子技術(shù)應(yīng)用，2026，52(2)：28-34. 英文引用格式： Li Chao，Li Bin，Wang Yan. Design and implementation of multi-core heterogeneous general-purpose control computer module[J]. Application of Electronic Technique，2026，52(2)：28-34.
Design and implementation of multi-core heterogeneous general-purpose control computer module
Li Chao，Li Bin，Wang Yan
Beijing Sunwise Space Technology Ltd.
Abstract： This paper demonstrates a design of high integrated and miniaturized multi-core general-purpose control computer module, which can be implemented through the system-in-packaging (SiP) technology. This module integrates nine large-scale integrated circuits, including multi-core DSP, FPGA, SDRAM, and Flash. It employs a high-temperature co-fired ceramic (HTCC) tube shell and utilizes a double-sided dual-cavity layout packaging design technology to achieve miniaturization, generalization, and high-density integration of complex system circuits. Additionally, to address issues such as the integrity of high-speed SerDes circuit signals, the difficulty of heat dissipation from high-power active devices, and the integrity of large-scale circuit power supplies within the module, a high-reliability design was achieved through comprehensive simulation and optimization methods covering mechanical, electrical, and thermal aspects. Small-scale trial production and functional performance testing have also been completed. The product measures 39 mm×39 mm×6.49 mm and weighs 29 g. Compared to a system composed of discrete components, the volume and weight are reduced by over 80%. At ambient temperature(25°C) and high temperature(105°C), the DSP and FPGA functions within the microsystem module operate stably, memory read/write operations function normally, and the high-speed communication rate can reach 5 Gb/s. All functions and performance indicators meet the design expectations. The work presented in this manuscript can provide ideas and methods for the miniaturization, high integration, and high-reliability design of similar system-level packaging products.
Key words : micro-system；system-in-packaging；high-temperature co-fired ceramic；multi-core heterogeneous；computer module
引言
針對當(dāng)前電子系統(tǒng)的核心關(guān)鍵元器件和計算機等部組件小型化、低成本和快速研制的迫切需求，在已有國產(chǎn)技術(shù)基礎(chǔ)上，如何快速提升電子系統(tǒng)的技術(shù)成熟度，大幅度降低電子產(chǎn)品體積、重量、成本，建立適用于通用化和批量化需求的元器件與部組件“短、平、快”研制流程，縮短研制和交付周期，是當(dāng)前亟需解決的核心關(guān)鍵技術(shù)攻關(guān)課題。采用系統(tǒng)級封裝（System in Package，SiP）[1-3]技術(shù)是當(dāng)前解決系統(tǒng)微小型化和有效提升產(chǎn)品可靠性的一條有效途徑，該技術(shù)更能滿足集成電路向更高集成度、更高性能、更高工作頻率發(fā)展的要求。目前國內(nèi)也有不少單位和研究機構(gòu)基于SiP技術(shù)進行了相關(guān)產(chǎn)品設(shè)計和可靠性研究工作[4-6]。
