中圖分類(lèi)號(hào)：TN42 文獻(xiàn)標(biāo)志碼：A DOI: 10.16157/j.issn.0258-7998.256748
中文引用格式： 顧江川，范沖. W波段高集成多通道多功能封裝模塊研究[J]. 電子技術(shù)應(yīng)用，2025，51(8)：103-107.
英文引用格式： Gu Jiangchuan，F(xiàn)an Chong. Study of W-band high-integrated multi-functional package modules[J]. Application of Electronic Technique，2025，51(8)：103-107.

Study of W-band high-integrated multi-functional package modules

Abstract： According to the requirements of W-band radio frequency (RF) front-ends, a couple of W-band four-channel up-conversion transmitter and down-conversion receiver modules based on ceramic packaging technology are designed . Both modules employ a single-conversion architecture. Through mixing, amplification, and filtering, the input intermediate frequency (IF) signal at the bandwidth of 78~80 GHz transforms into the output signal at the bandwidth of 92~94 GHz, and then the output signal transmits into the antenna port. The down-conversion receiver module processes W-band signals through low-noise amplification, mixing, and filtering, and then converts the signal to the bandwidth of 78~80 GHz for further processing at the back-end. The local oscillator (LO) signal for the front-end operates in the X-band, providing power division and signal amplification functions to supply LO signals for multiple channels. In order to realize the high performances，high stability and low cost of the RF modules, a filtering and transmission structure based on the load on package (LOP) technology is studied. The measured results of prototype show that the W-band up-conversion transmitter module achieves an output power over 12 dBm, the power gain is greater than 6 dB at the frequency of 92~94 GHz. The W-band down-conversion receiver module exhibits a noise factor less than 9 dB and a gain greater than 10 dB within the operating bandwidth.

Key words : W-band；package module；filter transmission structure