中圖分類(lèi)號(hào)：TN454 文獻(xiàn)標(biāo)志碼：A DOI: 10.16157/j.issn.0258-7998.244892
中文引用格式： 余秋實(shí)，郭潤(rùn)楠，陳昊，等. 應(yīng)用于收發(fā)鏈路多模塊級(jí)聯(lián)的優(yōu)化設(shè)計(jì)方法[J]. 電子技術(shù)應(yīng)用，2024，50(5)：77-83.
英文引用格式： Yu Qiushi，Guo Runnan，Chen Hao，et al. An optimization design scheme applied to multi-modules cascading of transceiver IC[J]. Application of Electronic Technique，2024，50(5)：77-83.

An optimization design scheme applied to multi-modules cascading of transceiver IC

Abstract： In this paper, a novel optimization design scheme is proposed to solve the cascading mismatch problem of sub-circuits in beamforming chips due to parasitic effects. The optimization design scheme proposed in this paper is a design scheme that realizes impedance “pre-mismatch” by introducing the impedance traction effect of adjacent modules and offsetting it with the cascade impedance mismatch. The theory of the “pre-mismatch” technique is provided in the article and a 4-channel X/Ku-band RF transceiver chip has been fabricated to verify the feasibility and effectiveness of this scheme. Compared to conventional designs, the chip operates within the frequency band of 8 GHz~18 GHz, with the receive and transmit average link gains of 6.5 dB and 14 dB, respectively. Both transceiver link gains are increased by more than 2 dB. The transmit link output power is 21 dBm and power-added efficiency is 15.7%，optimized by 1 dB and 9%. The receive link noise figure of 8.72 dB is reduced by 1.2 dB. The maximum phase-shifted root-means-square errors of the transceiver link are 5.25°and 5.12°, with a decrease of 1.75° and 3.17°.

Key words : multi-modules cascading；X/Ku-band；GaAs pHEMT；Monolithic Microwave Integrated Circuit （MMIC）；phased array transceiver