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基于LC巴倫的偽差分功率放大器設(shè)計
2020年電子技術(shù)應(yīng)用第8期
彭 林,李嘉進(jìn),梁釗銘,章國豪
廣東工業(yè)大學(xué) 信息工程學(xué)院,廣東 廣州510006
摘要: 為了在局部熱點區(qū)域?qū)崿F(xiàn)系統(tǒng)容量的成倍提升,需要能支持高頻、大帶寬工作的無線網(wǎng)絡(luò)基礎(chǔ)設(shè)施進(jìn)行超密集組網(wǎng),采用GaAs HBT工藝設(shè)計出適用于5G微基站的4.8~5.0 GHz三級高增益、大輸出功率放大器。利用偽差分結(jié)構(gòu)來抑制接地寄生電感的影響,通過片外低損耗LC巴倫完成單端與差分對之間的轉(zhuǎn)換,結(jié)合有源自適應(yīng)偏置網(wǎng)絡(luò)與RC負(fù)反饋電路,并應(yīng)用寬帶匹配與預(yù)失真補(bǔ)償?shù)姆椒ǎ贏DS仿真驗證了在中心頻點4.9 GHz處可實現(xiàn)35.8 dB的功率增益與33.5%的峰值功率附加效率,且工作頻帶內(nèi)能輸出不低于35 dBm的飽和功率,可滿足典型應(yīng)用場景對網(wǎng)絡(luò)信號無縫覆蓋的要求。
中圖分類號: TN722
文獻(xiàn)標(biāo)識碼: A
DOI:10.16157/j.issn.0258-7998.200302
中文引用格式: 彭林,李嘉進(jìn),梁釗銘,等. 基于LC巴倫的偽差分功率放大器設(shè)計[J].電子技術(shù)應(yīng)用,2020,46(8):9-12.
英文引用格式: Peng Lin,Li Jiajin,Liang Zhaoming,et al. Design of pseudo-differential power amplifier based on LC balun[J]. Application of Electronic Technique,2020,46(8):9-12.
Design of pseudo-differential power amplifier based on LC balun
Peng Lin,Li Jiajin,Liang Zhaoming,Zhang Guohao
School of Information Engineering,Guangdong University of Technology,Guangzhou 510006,China
Abstract: In order to greatly improve the system capacity in local hotspots, the wireless communication infrastructure that can support high-frequency and wideband operation is required for ultra-dense networking. A 4.8~5.0 GHz three-stage high-gain and large-output power amplifier is designed using GaAs heterojunction bipolar transistor(HBT) process to be targeted for 5G microcells. The pseudo-differential structure is adopted to suppress the influence of ground parasitic inductance, while the conversion between single-ended and differential pairs is completed by off-chip low-loss LC balun. In conjunction with active adaptive bias network and RC negative feedback circuit, meanwhile applying the methods of wideband matching and predistortion compensation, ADS(Advanced Design System) simulations verified that the proposed power amplifier can achieve 35.8 dB power gain with 33.5% peak power-added efficiency at a center frequency of 4.9 GHz, and deliver not less than 35 dBm saturated output power in the operating band, which can meet the requirements of seamless coverage of network signals in typical application scenarios.
Key words : balun;pseudo-differential; radio frequency power amplifier(RFPA);adaptive bias;5G microcell

0 引言

    作為新一代移動通信技術(shù),兼具高數(shù)據(jù)率、低時延與高可靠性的商用5G網(wǎng)絡(luò)將逐步滲透到社會各個領(lǐng)域,以用戶為中心構(gòu)建全方位的信息生態(tài)系統(tǒng),可滿足未來海量設(shè)備接入通信的需求。毫米波技術(shù)和Sub-6 GHz同屬于3GPP(3rd Generation Partnership Project)規(guī)定的5G標(biāo)準(zhǔn),但由于毫米波的波長較短,所致其信號傳輸衰耗大,易受環(huán)境的影響;Sub-6 GHz則是LTE(Long Term Evolution)頻段向上延續(xù)而來的帶寬資源,支持廣域覆蓋、高移動性服務(wù)等業(yè)務(wù)場景,一定程度上能夠利用現(xiàn)有的基站設(shè)施從而簡化5G部署[1]。按照規(guī)劃,國內(nèi)蜂窩網(wǎng)絡(luò)運(yùn)營商將在3.3~3.6 GHz以及4.8~5.0 GHz上進(jìn)行5G的初期組網(wǎng)。

    功率放大器作為無線通信系統(tǒng)中射頻前端發(fā)射通路的核心組件,是將已調(diào)制的頻帶信號放大到所需要的功率值,并饋送到天線上輻射出去。在微基站應(yīng)用中,由于硅基CMOS工藝存在耐壓能力不足、襯底損耗和Knee電壓較大等物理缺陷而被排除;寬禁帶GaN器件雖然能在更高的工作電壓下提供更優(yōu)的功率密度,但目前受限于生產(chǎn)成本、良率等因素暫不是最佳選擇,所以未來一段時間內(nèi)仍然以GaAs功放為主,因其具備經(jīng)市場驗證的可靠性、較高性價比和完整產(chǎn)業(yè)鏈的優(yōu)勢。為了應(yīng)對城區(qū)高用戶密度、大數(shù)據(jù)流量和眾多接入點,同時要解決更高工作頻率下所帶來愈發(fā)嚴(yán)重的寄生效應(yīng),密集架設(shè)的微基站群如何在保持一定帶寬的前提下,依然實現(xiàn)高增益、大功率輸出的指標(biāo)成為一項難題。本文基于2-μm InGaP/GaAs HBT工藝設(shè)計了一款4.9 GHz三級偽差分功率放大器,能有效減輕因芯片內(nèi)部、封裝與測試板接地時附帶的寄生電感對系統(tǒng)性能產(chǎn)生的不利影響,并通過片外LC巴倫實現(xiàn)單端與差分對之間的轉(zhuǎn)換,同時給出了整體電路的設(shè)計方法、理論分析和仿真結(jié)果。




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作者信息:

彭  林,李嘉進(jìn),梁釗銘,章國豪

(廣東工業(yè)大學(xué) 信息工程學(xué)院,廣東 廣州510006)

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