雙界面卡是由PVC層合芯片線圈而成,基于單芯片的,集接觸式與非接觸式接口為一體的智能卡,它有兩個操作界面,對芯片的訪問,可以通過接觸方式的觸點,也可以通過相隔一定距離,以射頻方式來訪問芯片??ㄆ现挥幸粋€芯片,兩個接口,通過接觸界面和非接觸界面都可以執(zhí)行相同的操作。兩個界面分別遵循兩個不同的標(biāo)準(zhǔn),接觸界面符合ISO/IEC 7816;非接觸符合ISO/IEC 14443.
雙界面卡構(gòu)成
雙界面卡/CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" 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title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡" title="CPU卡">CPU卡(TimeCOS/DI)是基于單芯片的、集接觸式與非接觸式接口為一體的智能卡,這兩種接口共享同一個微處理器、操作系統(tǒng)和 EEPROM.卡片包括一個微處理器芯片和一個與微處理器相連的天線線圈,由讀寫器產(chǎn)生的電磁場提供能量,通過射頻方式實現(xiàn)能量供應(yīng)和數(shù)據(jù)傳輸。
產(chǎn)品型號:TimeCOS/DI卡有兩種:
一種是基于飛利浦公司的Mifare PRO-MF2ICD80雙接口芯片開發(fā)的,其接觸部分符合ISO7816和《中國金融集成電路IC卡規(guī)范》的要求,非接觸部分符合ISO14443規(guī)范中的TYPE A類標(biāo)準(zhǔn)。
一種是基于西門子公司的SLE66CLXX系列雙接口芯片開發(fā)的,接觸部分符合ISO7816和《中國金融集成電路IC卡規(guī)范》,非接觸部分支持ISO14443-TYPE A 或TYPE B的雙界面卡。
卡片容量有8K BYTE 、16K BYTE可選。
雙界面卡的優(yōu)勢
一卡多用、一卡通用
卡片支持多應(yīng)用:一張卡片可以集成多個不同應(yīng)用多行業(yè)、多應(yīng)用同時發(fā)卡。應(yīng)用靈活、方便,根據(jù)不同應(yīng)用條件和要求,可任選采用接觸或非接觸交易方式,降低運營成本; 適用于交易量大,交易時間短,交易過程無需等候的試用環(huán)境中;機具全封閉,適用于惡劣工作環(huán)境和自助消費場所,抗破壞和抗干擾能力強;適用于對安全性要求高的系統(tǒng),可作為金融電子錢包應(yīng)用;卡片防沖突機制,允許多張卡片同時進入交易區(qū);與傳統(tǒng)接觸式設(shè)備完全兼容,可在其上直接使用
高度安全
芯片安全:采用內(nèi)帶隨機數(shù)據(jù)發(fā)生器的芯片,能夠防止物理、邏輯上的各種攻擊;芯片中的程序代碼COS,一經(jīng)寫入,即不可再現(xiàn);每個芯片具有唯一的出廠代碼。操作系統(tǒng)安全:支持singleDES和TripleDES算法:可自動根據(jù)密鑰長度選擇singleDES或TripleDES算法;支持線路加密和保護功能,防止通訊數(shù)據(jù)被非法竊取或篡改;多種密鑰類型支持密鑰的不同使用方式。傳輸安全:非接觸方式進行數(shù)據(jù)傳輸遵循相關(guān)的傳輸協(xié)議,經(jīng)過卡片和機具的加密處理,數(shù)據(jù)即使被截獲也不會泄密。
快速交易
芯片內(nèi)含DES運算加速器,可快速完成SingleDES、TripleDES等算法,一次TripleDES運算時間為130微秒;非接觸通訊時,通訊傳輸速率為106KBPS; 接觸部分的通訊速率可以調(diào)整,通訊速率可以達到38400bps.
兼容性好
符合《中國金融集成電路(IC)卡規(guī)范》的要求;符合ISO14443 標(biāo)準(zhǔn)中的Type A,以后的基于西門子芯片的雙界面卡支持Type A 或Type B.目前應(yīng)用的支持Mifare-I卡片讀寫的機具,只需要進行軟件的升級就可以很容易實現(xiàn)對支持Type A的Mifare-Pro類型TimeCOS/DI的讀寫。
雙界面CPU卡封裝工藝說明
雙界面CPU卡作為一種新技術(shù)其卡片封裝也有其特殊的要求。目前所應(yīng)用的封裝工藝主要有兩種:層壓和注塑。雙界面卡與普通的接觸式卡片相比,增加了一組天線,同時也增加了卡片封裝工藝的難度,目前使用雙界面卡封裝工藝存在一定的問題:天線是非接觸方式下芯片與讀寫機具之間進行能量傳遞和通訊的介質(zhì),一般在封裝中,天線與芯片的觸點間是以導(dǎo)電橡膠來連接,由于工藝和導(dǎo)電橡膠的問題,一些卡片的天線與觸點的連接不穩(wěn)定,經(jīng)常會出現(xiàn)雙界面卡在封裝完成以后或使用一段時間,非接觸界面不能正常工作的情況,在應(yīng)用測試中,由于封裝問題導(dǎo)致卡片非接觸界面不能正常工作的比例占卡片故障率的絕大多數(shù)。公司在雙界面卡的封裝中,采用了一種獨特的封裝工藝,解決了雙界面卡的天線與觸點之間連接問題,使天線與觸點之間的連接更加牢固可靠;由于這項技術(shù)的應(yīng)用,雙界面卡的封裝成品率和在使用中非接觸界面出現(xiàn)故障的情況已經(jīng)大為減少。
雙界面卡有以下三種:
1. 接觸式智能卡系統(tǒng)與非接觸式智能卡系統(tǒng)僅僅是物理的組合到一張卡片中,兩個EEPROM,兩套系統(tǒng)互相獨立。
2. 接觸式智能卡系統(tǒng)與非接觸式智能卡系統(tǒng)彼此操作獨立,但共享卡內(nèi)部分存儲空間。
3. 接觸式智能卡系統(tǒng)與非接觸式智能卡系統(tǒng)完全融合,接觸式與非接觸式運行狀態(tài)相同,共用一個CPU管理。三種雙界面IC卡中,只有最后一種雙界面IC卡才是真正意義上的非接觸式雙界面CPU卡。