Cypress公司的CY8CKIT-036 PSoC熱管理擴(kuò)展板用來評(píng)估系統(tǒng)的熱管理功能和PSoC架構(gòu)的能力,支持多達(dá)4線風(fēng)扇的控制,六個(gè)不同模擬和數(shù)字傳感器組合的溫度檢測(cè),基于EEPROM的數(shù)據(jù)記錄,I2C/SMbus/PMbus主接口,熱區(qū)管理(溫度和風(fēng)扇速度的關(guān)系),檢測(cè)熱和冷卻故障或告警的算法.典型解決方案包括多個(gè)器件如CPLD,混合信號(hào)ASIC和/或有限功能以及剛性分立器件.本文介紹了CY8CKIT-036 PSoC熱管理擴(kuò)展板主要功能,框圖,熱管理功能(TME)功能框圖以及擴(kuò)展板電路圖,材料清單和PCB元件布局圖.

In general terms, thermal management is a combination of temperature sensing, fan control and the algorithms or transfer functions that map temperature to fan speed. Thermal management is a critical, system-level function that needs to ensure that all components in the system operate within safe temperature limits, while at the same time minimizing power consumption and acoustic noise.

Typical solutions for thermal management include multiple devices such as CPLDs, mixed-signal ASICs and/or limited-functionality and inflexible discrete devices. Thermal management solutions need to be flexible enough to interface with many kinds of both digital and analog temperature sensors. To maximize efficiency, they must also be able to drive a multitude of fans independently. Finally, thermal management solutions must have enough intelligence built in to reliably control the cooling systems autonomously, independent of a master control processor in the event that communications are lost or the master control processors fail or go offline. The PSoC?3 architecture enables a flexible and unique method of thermal management in a single chip, combining analog sensing capabilities for any kind of analog temperature sensor such as remote diodes, thermistors, resistance temperature detectors (RTDs), etc. PSoC 3抯 versatile digital resource pool enables the integration of multiple I2C bus interfaces, capture timers and even full-custom logic to support interfaces to a wide variety of digital temperature sensors such as I2C based, pulse-width-modulated (PWM) based and other proprietary serial interface digital temperature sensors. PSoC 3抯 unique CPLD-like hardware blocks are also used to implement a full hardware closed loop fan control system for high reliability systems that require zero intervention from firmware running on the built-in MCU or running on an external master control processor. This frees up MCU processing power to run and manage algorithms or transfer functions of very high complexity to optimize fan speeds to achieve system cooling requirements.

The PSoC Thermal Management Expansion Board Kit (TME EBK) is a part of the PSoC development kit ecosystem and is designed to work with the CY8CKIT-001 PSoC Development Kit (DVK) and CY8CKIT-030 PSoC 3 Development Kit (DVK). It enables you to evaluate a system抯 thermal management functions and capabilities of PSoC 3 devices. You can evaluate the example projects described in this guide or design and customize your own thermal management solution using components in Cypress抯 PSoC CreatorTM software (included in this kit) or by altering example projects provided with this kit.

The PSoC Thermal Management Expansion Board Kit (TME EBK) is used with the PSoC family of devices and is specifically designed and packaged for use with the PSoC 3 device family. PSoC 3 is a programmable system-on-chip platform that combines precision analog and digital logic with a high performance, single-cycle, 67MHz 8051 processor. With the flexibility of the PSoC architecture, you can easily create your own custom thermal management solution on chip with the exact functionality you need, in the way you want it- no more, no less.

The TME EBK is intended to provide a demonstration and development platform for developing system thermal management co-processor solutions with compelling example projects that demonstrate a variety of modes:

Temperature monitoring

Open-loop and closed-loop fan control

Thermal zone management: the relationship between temperatures and cooling functions
Algorithms to detect thermal and cooling failures or warnings

The TME EBK contains two 4-wire, 12V brushless DC fans with connectors to support an additional 2 fans for designers who need to prototype with their own specific fan models. 6 temperature sensors (4 different kinds) are also installed on the kit: 1) TMP175 I2C digital temperature sensor, 2) 2x TMP05 PWM output digital temperature sensors, 3) DS18S20 “One Wire” digital temperature sensor and 4) 2x MMBT3094 temperature diodes. This combination of hardware elements enables designers to rapidly prototype thermal management solutions in a variety of configurations.

TME EBK also provides an I2C/SMBus/PMBus compatible header to support systems that have a requirement for communication with a host controller. All of this functionality is implemented on a single PSoC 3. The TME routes all the input/output signals for thermal management to a PSoC 3 mounted on a development kit platform such as the CY8CKIT-001 PSoC Development Kit or CY8CKIT-030 PSoC 3 Development Kit. PSoC 3 is not mounted on the TME EBK itself.

The PSoC Thermal Management Expansion Board Kit enables you to evaluate System Thermal Management functions and capabilities of the PSoC architecture.

The Thermal Management Expansion Board Kit (EBK) supports:

Fan control of up to four 4-wire fans (both firmware or hardware based)

Temperature sensing of a combination of six different analog and digital sensors

EEPROM based data logging capabilities

I2C/SMbus/PMbus host interface

Thermal zone management: the relationship between temperatures and fan speeds

Algorithms to detect thermal and cooling failures or warnings

PSoC熱管理套件包括:

PSoC® Thermal Management Expansion Board

Quick Start Guide

Power DC Adaptor 12V/2A

System CD containing:

User’s Guide

PSoC Creator™ and pre-requisite software

PSoC Programmer and pre-requisite software

Example Projects: (for both CY8CKIT-001 and CY8CKIT-030)

Firmware based (open loop) Fan Control

Hardware based (closed loop) Fan Control

Thermal Management System

Application Notes and Key Component Datasheets


圖1.CY8CKIT-036 TME PCB外形圖

圖2.CY8CKIT-036 TME 方框圖

圖3.熱管理功能(TME)功能框圖

圖4.CY8CKIT-036 TME板電路圖

CY8CKIT-036 TME板材料清單:
 




圖5.CY8CKIT-036 TME PCB元件布局圖
詳情請(qǐng)見:
http://www.cypress.com/?docID=32703
和
http://www.cypress.com/?docID=32606